Modeling and Design of Electromagnetic Compatibility for High-speed Printed Circuit Boards and Packaging
Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.
This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.
Catégories:
Année:
2017
Edition:
1
Editeur::
CRC Press
Langue:
english
Pages:
341
ISBN 10:
1138033561
ISBN 13:
9781138033566
Fichier:
PDF, 12.66 MB
IPFS:
,
english, 2017